Moisture Diffusion Simulation in Printed Circuit Boards



Printed circuit boards (PCBs) are the fundamental component for almost all electronic products. When PCBs are exposed to humid, ambient conditions, moisture absorption occurs. This results in issues, such as swelling induced failure and signal performance degradation that compromise device reliability. To avoid these challenges, it is crucial for manufacturers to understand the kinetics of moisture diffusion in PCBs.


Watch this webinar to hear Dr. Hicham Farid, a Dassault Systèmes SIMULIA Industry Process Consultant, discuss SIMULIA’s Abaqus solution and how it can capture moisture diffusion kinetics in PCBs.


Webinar Highlights:


  • Overview of Abaqus Mass Diffusion capabilities

  • Reducing the risk of PCB redesign through a better understanding of moisture diffusion kinetics

  • Coupled Mass-Diffusion-Structural analysis in Abaqus to capture the moisture induced swelling in PCBs


About the Speaker:


Hicham Farid - SIMULIA Industry Process Consultant - Dassault Systèmes

Dr. Hicham Farid has a PhD in Mechanical Engineering from the University of Quebec, Canada, where his research focused on Fracture Mechanics. His primary interests are material modeling and calibration, fracture mechanics, plastics and composites, and fatigue and creep interaction. Before joining Dassault Systèmes, Hicham spent 12 years working as R&D Engineer/Scientist at leading organizations in the aerospace, nuclear, and renewable energy industries. He is passionate about new technology and enjoys sharing this passion with others by helping businesses and industry professionals challenge the status quo and navigate new, technological horizons.



This webinar is sponsored by Dassault Systèmes.